Electronics Forum | Thu Sep 24 00:42:37 EDT 2009 | rohitfast
Can you pl let us know what was the ESD sensitivity level of your assembly? We are also using plastic stencil from last 3 years and not seeing any major diffficulties in our class-3 product.
Electronics Forum | Wed Mar 06 10:29:40 EST 2013 | sara_pcb
What is the minimum solder mask thickness required for Class 3 products. We are insisting fabricator of the pcb shop to use only spray coated solder mask. The SM thickness on the epoxy is about 17 microns, In the center of the tracks are 8 microns an
Electronics Forum | Sat Oct 19 08:28:04 EDT 2019 | davef
Hi Davandran ... Butt leads are not intended for high mechanical strength applications. That's why butt leads are not allowed in Class 3 products. If you want to be sure that your butt leaded component stays on the board, just glue it after solderin
Electronics Forum | Sun Aug 11 17:56:50 EDT 2024 | pradeep14
Hi, We are running IPC CLASS 3 products, so we should maintain Solderbility more than 75%
Electronics Forum | Tue Jul 23 15:41:31 EDT 2002 | habs24
Does anyone have any information or experience soldering of class 3 products with WS fluxes. We are currently leaning toward Alpha WS609 flux, however the customer's interpretation of J-Std-001C feels that type 'H' fluxes (WS) are not allowed. Any
Electronics Forum | Wed Jul 24 22:45:54 EDT 2002 | davef
WS609 is a wonderful paste. J-STD-001, 4.2 states words to the effect that for Class 3 products Type H or M fluxes should only be used for tinning operatins. Most water soluable fluxes are either H or M. I believe that you can use Type H or M flux
Electronics Forum | Sat Jan 10 05:55:13 EST 2015 | jandon
Rework is acceptable in class 3 but hardware defects shall be documented before rework and rework shall be documented.
Electronics Forum | Tue Nov 11 12:49:13 EST 2003 | Carol
Could you direct me to a Standard or Study that has used this termination with 67/37 tin/lead solder please? I am looking for the recommended reflow temperature requirements and reliability issues for the completed product. We are receiving this type
Electronics Forum | Thu Mar 15 03:24:48 EST 2001 | Scott B
We are currently having a conflict of opinion with our QA department regarding the very few occurences we have of chip resistors being soldered upside down (i.e. the resistive element towards the board). IPC-A-610C para 12.3.2 specifies that this co
Electronics Forum | Fri Sep 21 11:59:26 EDT 2001 | Carol Stirling
We build IPC Class 3 product and are introducing Plastic Ball Grid Arrays. There is a possibility of out-soucing the build, so I'm interested in the Standards or Specifications the industry is quoting to ensure placement, inspection, reliability etc.
