Industry Directory: class2 (20)

X & D Electronic Assembly

Industry Directory | Manufacturer

An electronics assembly services co. Specializes in assembly upto IPC-A-610, Class 2. Very competitive pricing structure and and very quick turn. Commercial CCA, cable, SMT, thru-hole, rework.

Fast Circuits Inc.

Industry Directory | Manufacturer

Headquartered in Sacramento, Fast Circuits Inc. provides PCB fabrication and assembly services. Since 2009, it has manufactured PCBs in low to middle volumes, as well as flexible or rigid PCB prototypes.

New SMT Equipment: class2 (15)

Filters and Screens

Filters and Screens

New Equipment | Materials

Orion provides flexible, polyurethane filter foam to remove dust and contaminating particles from the air, gases and liquids in a variety of applications. The open pore skeletal structure provides low air resistance ideal for use in computers, electr

ORION Industries

PCB manufacturing service

New Equipment | Assembly Services

100% manufacturability check prior to production IPC Class 2 specifications 100% electrical test on all boards Fully-finished PCBs with 2 solder-masks and 1 or 2 silk-screens Full finish on copper: HASL, RoHs, gold or silver .  1

Caring Circuit Tech Limited

Electronics Forum: class2 (134)

class 2 vs class 3 cost for assembly

Electronics Forum | Mon Apr 13 18:18:31 EDT 2020 | wbrenner

Does any one have a general cost percent going from class 2 to class 3 for the same Assembly.. Or, general up charge percent when biding class 2 vs class 3?

Confused....Need Help On AS9100

Electronics Forum | Thu Aug 07 22:51:05 EDT 2008 | davef

We expect aerospace to be IPC-A-610, Class 3 and J-STD-001, Class 3. The above quality statement stecifies: * "IPC 610, Class 2 acceptability." This is unclear. Should this be "IPC-A-610, Class 2 acceptability?" * No class for J-STD-001. Should we a

Industry News: class2 (26)

Third Session of the High-Rel Cleaning & Conformal Coating Conference to Focus on Conformal Coating for Class 2 and 3 Electronic Assemblies

Industry News | 2016-09-29 20:17:32.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Three Speakers

Industry News | 2008-09-21 01:46:38.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Joe Russeau (Session Chair) of Precision Analytical Laboratory, Dr. Bev Christian of Research in Motion, Dave Hillman of Rockwell Collins, Matt Kehoe of Sipad Systems, and Doug Schueller of AbleConn will present during Session 3 on Building to Customer Reliability Standards in Class 2 and Class 3. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Association Connecting Electronics Industries (IPC)

Technical Library: class2 (2)

Effects Of Storage Environments On The Solderability Of Nickel Palladium- Gold Finish With Pb-Based And Pb- Free Solders

Technical Library | 2022-03-02 21:26:51.0

The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).

Sandia National Laboratories

A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability

Technical Library | 2021-07-20 20:02:29.0

During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.

NASA Office Of Safety And Mission Assurance

Videos: class2 (5)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials.

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials.

Videos

This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert

BEST Inc.

Training Courses: class2 (7)

IPC-A-600 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-600 Specialist (CIS)

The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.

NASA Manufacturing Technology Transfer Center (NMTTC)

Mixed Technology Rework Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Career Center - Jobs: class2 (4)

SMT Machine Operator

Career Center | Sarasota, Florida | Production

Operation of SMT equipment including Screenprinters, Chipshooters, Component Mounters, Reflow Ovens, etc. Set-up new jobs. Inspection to IPC-A-610 Class 2. Competitive wages and excellent benefit package. Qualified candidates may apply via email

Teltronics, Inc.

Sr SMT Process Engineer

Career Center | Seymour, Connecticut USA | Engineering

Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a

Sales Consultants of Buffalo

Career Center - Resumes: class2 (2)

qa inspector

Career Center | , California | Quality Control

Tammy T Vo P.O. Box 2213 (714) 254-5073  E-mail: nhutamvo@yahoo.com Position of Interest  Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications  12 years of experience wo

Manufacturing Manager

Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support

A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te

Express Newsletter: class2 (2)


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