World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Industry News | 2013-11-22 11:18:31.0
Balver Zinn today announced that it has granted sublicenses to Stannol GmbH, Wuppertal and Felder GmbH, Oberhausen for the popular SN100C® alloy patented by Nihon Superior Co. Ltd. for manufacturing in Germany and sales globally with the exception of UK and Ireland.
Industry News | 2014-04-07 17:54:09.0
The Balver Zinn Group announces it will attend SMT/Hybrid/Packaging 2014, scheduled to take place May 6-8 in Nuremberg, Germany.
Industry News | 2014-03-12 13:55:52.0
BALVER ZINN today announced that it has granted a sub-license to Estaños Senra S.L. for the popular SN100C® alloy patented by Nihon Superior Co. Ltd. for manufacturing and sales throughout Spain.
Industry News | 2013-06-06 19:12:21.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN
Industry News | 2018-01-18 04:01:33.0
Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.
Industry News | 2017-10-23 05:56:23.0
After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning To ensure you are equipped to get maximum benefit from the event, read our Webinar Guide https://www.bobwillis.co.uk/wp-content/uploads/2017/01/WebinarAttendance2017.pdf
Industry News | 2013-09-30 16:14:16.0
Balver Zinn today announced that it has been granted the right to sub-license the SN100C® patent by Nihon Superior Co. Ltd.
Industry News | 2017-05-01 05:11:48.0
The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place May 16-18 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.
Industry News | 2013-10-09 09:50:45.0
The Balver Zinn Group today announced that it will sponsor the IPC hand soldering competition at Productronica, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
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