New Equipment | Cleaning Agents
KYZEN E5325 is used in spray-in-air applications to effectively and efficiently perform off-line maintenance cleaning to remove even the most difficult fluxes and solder pastes from pallets, wave solder fingers, reflow oven parts and associated tooli
New Equipment | Cleaning Agents
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated underst
New Equipment | Cleaning Agents
MICRONOX MX2100 is an aqueous, single-phase solvent designed to remove tough flux residue from PMIC devices including IGBT modules and power MOSFETs. MX2100 has a well-balanced formula that provides outstanding cleaning performance and metal compatib
New Equipment | Cleaning Agents
AQUANOX A4639 is an aqueous cleaning solution designed for hard to clean lead-free, rosin and no-clean flux residues in batch cleaning systems. A4639 provides exceptional cleaning results and protection of metallic surfaces with minimal monitoring an
New Equipment | Cleaning Agents
MICRONOX MX2150 is a used as received cleaning agent that is designed to remove flux residues from Camera Module (CMOS, CCD) assemblies. MX2150 is effective on a broad range of Pb-free process flux residues in ultrasonic systems, and preserves shine
New Equipment | Cleaning Agents
AQUANOX A4651US is a low pH cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. A4651US reduces the cavitation threshold, will completely remove flux residues from printed circuit assemblies and is compatible with
New Equipment | Cleaning Agents
AQUANOX A8830 cleans solder paste from stencil apertures in ultrasonic immersion cleaning tanks. A typical wash cycle using a 10% solution of A8830 at room temperature typically requires less than a 4-minute wash cycle and easily rinses with water, l
New Equipment | Cleaning Agents
IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents and inhibitors. FCR is engineered to remove organic acid, rosin and no-clean flux residues from electronic assemblies, advanced packages, hybrid and SMT substra
New Equipment | Cleaning Agents
KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-ef
New Equipment | Cleaning Agents
KYZEN E5631J is a ready-to-use solution for removing raw solder paste from stencils both in online and offline stencil cleaning processes. E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder pastes to make
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