Industry News | 2016-05-21 08:04:11.0
Oak-Mitsui are proud to announce an expanded strategic partnership adding Oak Mitsui’s proprietary ABC (aluminum bonded copper) to Insulectro’s premier product portfolio including CAC (copper aluminum copper). By leveraging their bicoastal manufacturing locations, ABC will continue to manufacture its bonded product in Hoosick Falls, NY and Insulectro will continue to manufacture CAC at its facility in Lake Forest, CA. The complete line of Oak-Mitsui copper foils, on CAC and ABC, will be available in Insulectro’s inventory by June 17, 2016.
New Equipment | Solder Materials
Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f
Industry News | 2010-04-19 12:50:06.0
NASHVILLE — April 2010 — Kyzen, the world leading provider of environmentally responsible cleaning products for high reliability and high-technology manufacturing operations, will feature METALNOX® M6330 and METALNOX® M6319 in booth 101 at the upcoming Process Cleaning Expo, scheduled to take place May 4-6, 2010 at the Kentucky International Convention Center in Louisville, KY.
Industry News | 2013-02-06 18:55:12.0
Kyzen, will exhibit in Booth #1403 at the upcoming Parts Cleaning Expo co-located with the Precision Machining Technology Show (PMTS), scheduled to take place April 16-18, 2013 in Columbus, OH.
Industry News | 2013-01-15 16:31:41.0
– AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo,
Industry News | 2010-05-11 12:05:21.0
NASHVILLE — Kyzen, a world leading provider of environmentally responsible cleaning products for high reliability and high-technology manufacturing operations, will feature METALNOX® M6330 and METALNOX® M6319 in booth 3021 at the upcoming EASTEC Advanced Productivity Exhibition, scheduled to take place May 25-27, 2010 at the Eastern States Exposition Grounds in West Springfield, MA.
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The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
Industry News | 2013-03-28 10:58:43.0
Kyzen announces that it will highlight its METALNOX® M6310 in Booth #3042 at the EASTEC Eastern states exposition
Industry News | 2022-05-18 13:01:33.0
Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.
