Industry News | 2016-02-16 20:18:38.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2018-09-04 10:25:16.0
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Industry News | 2018-02-01 20:18:01.0
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.
Industry News | 2019-04-01 19:37:06.0
Nordson MARCH announces the introduction of its FlexTRAK®-SHS automated plasma treatment system. The plasma system includes the 9.6-liter (585 in³) large-volume F3-S process chamber that can be configured for larger strips or can treat more strips per cycle, yielding higher throughput and increased productivity for semiconductor and electronics packaging.
Industry News | 2015-10-05 18:14:25.0
Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Industry News | 2015-10-11 18:04:26.0
Indium Corporation announces the release of its newest technology publication, SMT with Phil Zarrow, authored by SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting.
Industry News | 2015-10-30 15:33:26.0
Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
Industry News | 2015-12-01 11:54:33.0
Koh Young Technology, the market leader in solder paste inspection and automated optical inspection systems, held its annual Koh Young Americas National Sales Meeting in October. More than 30 of the top manufacturer’s representatives in the Americas joined the sales training and products workshops with team-building sessions. Juan Arango, Americas Sales Director, stated, “Our goal is to help educate our sales channel partners to become better informed and aware of every benefit that our 3D inspection technologies offer. This enables them to provide even greater value and solutions to our customers. It keeps them best-equipped to support our customer base in delivering the value of true 3D inspection.”
-세계 최고 품질의 대류열풍방식으로 새로운 표준을 선도하는 HELLER Reflow Oven -10년 연속 World Wide Market Share 1위와 2014 SERVICE EXCELLENCE AWARDS 수상
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Phone: +82-31-769-0808
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