Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Part No: MSD5AZA1Y Model No: DRIVER UNIT Output: 50W Removed from a TEL Tokyo Electron Clean Trac
Industry News | 2016-07-10 12:08:40.0
All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry
Industry News | 2015-03-17 05:00:13.0
Conformal Coating, Bottom Mounted Components and Robotic Soldering are featured workshops presented by Bob to coincide with Nepcon Malaysia. The Knowledge Group have invited Bob to present three one day workshops in Penang 9-11th June. For further information visit http://knowledgegroupco.com/index.php/component/jcalpro/events/day?date=2015-06-09 The workshops include: BMC (Bottom Mounted Component) LGA (Land Grid Array) QFN (Quad Flat No-lead) Design, Assembly & Rework Guide Conformal Coating Applications, Inspection, Rework & Quality Control High Temperature Electronic Manufacture with Selective, Laser and Robotic Point Soldering
Industry News | 2017-03-06 05:20:47.0
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Industry News | 2015-10-11 15:35:54.0
New placement modules, tapeless feeders, new screen printers and the first expert system that optimizes SMT processes automatically. At Productronica 2015 (November 10-13, Munich Trade Fair Center), technology leader ASM Assembly Systems will present a show unlike any other under the motto “On the move to the Smart #1 SMT Factory”. On 650 square meters at booth A3.377, the SMT experts will lay out their roadmap to the Smart Factory with a “Speed Quality” line and a “Flexible Quality” line featuring totally innovative technologies. The focus will be best-in-class equipment, automation tools, production process networking and integration, and transparent material logistics. At the “Speed Quality” line, new SIPLACE TX placement modules will ring in the mass placement of super-small 0201 (metric) components. A single SIPLACE TX module alone can place up to 78,000 of these per hour at full speed at smallest footprint. With its compact design, it also sets new records in speed, floorspace performance and placement accuracy. Components in sizes from 0402 through 01005 will be supplied loosely and without tapes thanks to the new SIPLACE BulkFeeder. This ASM innovation finally bans reels and splicing from the SMT production floor. With the DEK NeoHorizon and DEK NeoHorizon Back-to-Back, the ASM team will also unveil new, powerful screen printers. Most of the visitors’ attention, however, will be focused on the ASM ProcessExpert. This first inline expert system in the industry establishes a new product category in electronics manufacturing. By running virtual prints based on Gerber data, the ASM ProcessExpert subjects the stencil to a DFM (design for manufacturability) health check. By stabilizing and optimizing the printing process automatically, this highly innovative system represents a milestone on the path to self-optimizing SMT lines. Each of these innovations constitutes a building block for the Smart Factory.
Electronics Forum | Wed Feb 01 11:47:07 EST 2006 | Mike
James, If you have a true MSD issue, then baking them AFTER your reflow is not going to fix the issue. I would have to agree with GS and look at trapped cleaner media (if your not No-clean) under the components, or inside connectors. If your runnin
Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS
How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor
Electronics Forum | Mon Nov 06 13:35:10 EST 2006 | Theresa Spear
We are starting up a new clean room for SMT production and wondering if anyone is aware of any guideline for operating humidity and temperature ranges for the room. We know that the MSD's will prefer it to be dry and cool. However, there are other f
Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax
Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
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