Industry News | 2018-03-25 13:21:16.0
The widest selection of online webinars in the industry has added more titles
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Industry News | 2015-03-17 05:00:13.0
Conformal Coating, Bottom Mounted Components and Robotic Soldering are featured workshops presented by Bob to coincide with Nepcon Malaysia. The Knowledge Group have invited Bob to present three one day workshops in Penang 9-11th June. For further information visit http://knowledgegroupco.com/index.php/component/jcalpro/events/day?date=2015-06-09 The workshops include: BMC (Bottom Mounted Component) LGA (Land Grid Array) QFN (Quad Flat No-lead) Design, Assembly & Rework Guide Conformal Coating Applications, Inspection, Rework & Quality Control High Temperature Electronic Manufacture with Selective, Laser and Robotic Point Soldering
Industry News | 2018-10-11 19:44:24.0
KYZEN today announced that Mike Bixenman, DBA, will present three papers during the technical sessions at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2017-01-17 16:35:22.0
KYZEN is pleased to announce that one of Dr. Mike Bixenman’s papers that was presented during SMTA International 2016 has been selected by the SMTA for a Best Paper Award. Dr. Bixenman won the Rich Freiberger Best of Conference Award for his presentation entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes.” Bixenman co-authored the paper with Mark McMeen and Jason Tynes from STI Electronics.
Industry News | 2011-09-28 19:53:50.0
AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.
Industry News | 2017-09-05 16:01:43.0
SMART Group, Europe’s largest technical trade association focusing on Surface Mount And Related Technologies, announces that its latest Process Defect Photo Guide “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
Industry News | 2017-03-06 05:25:35.0
Many of the webinars we present every month are available from our online archive. The video recordings and a copy of the slides can be provided for you or why not organise an education session with members of your team in a conference room so you can also discuss the subject after the session to implement your process improvements
Industry News | 2017-01-17 15:39:40.0
STI Electronics today announced that it has been selected to receive the “Best of Conference” award for a paper presented during SMTA International in September. The paper entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” was co-authored by Dr. Mike Bixenman of KYZEN, and Mark McMeen and Jason Tynes from STI Electronics.