Technical Parameters Version TM240A Applicable PCB 20mm*20mm~400mm*360mm Placement head quantity 2 Max mounting capability 7000PCS/h Positioning accuracy ±0.025mm Applicable Components 0402-5050,SOP, QFN, IC Components supply configuration Tape reel,
Technical Parameters Version TM220A Applicable PCB 20mm*20mm~220mm*200mm Placement head quantity 2 Max mounting capability 7000PCS/h Positioning accuracy ±0.025mm Applicable Components 0402-5050,SOP, QFN, IC Components supply configuration Tape reel,
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2014-01-31 00:23:23.0
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
Industry News | 2018-10-23 10:46:00.0
More focused webinars than any other online provider for the electronics industry. If you have a specific topic you would like us to present online let us know so we can support your team with process solutions https://www.bobwillis.co.uk/events/
Industry News | 2020-01-15 15:19:33.0
StratEdge Corporation announces that Reginald (Regi) Nocom has joined StratEdge as a process engineer. With over 20 years in the microelectronics industry and extensive experience in implementing Six Sigma practices, Nocom is well-positioned to lead StratEdge in the development of new processes for manufacturing semiconductor packages and enhancing StratEdge's IC package assembly services.
Industry News | 2011-07-22 23:48:37.0
DEK introduced two breakthrough technologies, ProActiv and Nano-ProTek stencil coating, to customers in Chengdu last week.
Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
Industry News | 2015-10-05 18:14:25.0
Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Industry News | 2016-07-10 12:08:40.0
All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry
