New Equipment | Cleaning Agents
ACL's complete line of high purity solvents are the finest, most effective products made for the critical cleaning and degreasing of electronics, electrical assemblies and sensitive components. Each cleaning agent possesses unique properties suited t
New Equipment | Cleaning Agents
VOC, CFC & HCFC FREE, Non-Aggressive, Very Mild Odor, Non Flammable, Non Toxic Certified as a “Clean Air Solvent” by the South Coast Air Quality Management District (SCAQMD), (AQP) is more than 95% water based and all ingredients are 100% active.
Industry Directory | Distributor
Buys,sells, rents, consults on vapor degreasers
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Industry News | 2018-05-09 20:32:24.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at SMT Hybrid Packaging 2018. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Hall 4A, Stand 536, June 5-7, 2018 at the Messe in Nuremberg, Germany. The introduction video can be viewed here: www.KYZEN-SneakPeek.com
Industry News | 2017-02-15 19:01:59.0
KYZEN today announced that it received two 2017 NPI Awards. The company was awarded in the category of Process Control Tools for the new ANALYST™ Real-Time Concentration Monitoring & Reporting System, and Cleaning Materials for the KYZEN® DS3522 DuoSolvent™ Cleaning Agent. The awards were presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2016-02-16 11:39:48.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at the 2016 IPC APEX EXPO. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Booth #1869, March 15-17, 2016 at the Las Vegas Convention Center.
Events Calendar | Tue May 21 00:00:00 EDT 2019 - Tue May 21 00:00:00 EDT 2019 | Rockville, Maryland USA
Improving Reliability of Circuits Assemblies Workshop
Events Calendar | Thu May 23 00:00:00 EDT 2019 - Thu May 23 00:00:00 EDT 2019 | Raleigh, North Carolina USA
Improving Reliability of Circuits Assemblies Workshop
Events Calendar | Tue Jun 25 00:00:00 EDT 2019 - Tue Jun 25 00:00:00 EDT 2019 | West Melbourne, Florida USA
Improving Reliability of Circuits Assemblies Workshop
