Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Used SMT Equipment | AOI / Automated Optical Inspection
Make: SakiModel: 3Di-LD2 Details:1.Multiple Sizes Supported: 50 x 60 mm to 500 x 510 mm.2.High Resolution: 7 µm to 18 µm.3.Power Adaptability: 200-240V, 50/60 Hz.4.Clearance Height: Top 40 mm, Bottom 50 mm.5.Machine Dimensions: 1040 x 1440 x 1500 mm
Used SMT Equipment | Pick and Place/Feeders
Make: SakiModel: 3Di-LD2 Details:1.Multiple Sizes Supported: 50 x 60 mm to 500 x 510 mm.2.High Resolution: 7 µm to 18 µm.3.Power Adaptability: 200-240V, 50/60 Hz.4.Clearance Height: Top 40 mm, Bottom 50 mm.5.Machine Dimensions: 1040 x 1440 x 1500 mm
Used SMT Equipment | AOI / Automated Optical Inspection
Make: SakiModel: 3Di-LD2 Details:1.Multiple Sizes Supported: 50 x 60 mm to 500 x 510 mm.2.High Resolution: 7 µm to 18 µm.3.Power Adaptability: 200-240V, 50/60 Hz.4.Clearance Height: Top 40 mm, Bottom 50 mm.5.Machine Dimensions: 1040 x 1440 x 1500 mm
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Used SMT Equipment | Soldering Equipment/Fluxes
WANTED: Electronics Manufacturing Company seeking Wave Soldering Equipment in good condition w/ the following features: 1. Convection Pre-Heating; 2. 2-3 zones: Bottom & Top 3. Auto Lead Clearance Adjustment [recipe driven auto pot height adj
Used SMT Equipment | Screen Printers
The ultimate fine pitch printer Key Features • Self learning fiducial camera's. • Digital controlled Squeegee pressure. • All machine parameters are programmable and PC controlled. • Vision for board alignment using 2 CCD cameras. • Quick-lock c
Used SMT Equipment | Screen Printers
The ultimate fine pitch printer Key Features • Self learning fiducial camera's. • Digital controlled Squeegee pressure. • All machine parameters are programmable and PC controlled. • Vision for board alignment using 2 CCD cameras. • Quick-lock c
New Equipment | Rework & Repair Equipment
Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
The system features high clearance for assemblies with up to 300mm height. Main application is the foil and PTH inspection. X-ray system features Inspection program control system with automatic defect detection and defect verification capability
