Industry Directory | Consultant / Service Provider
Independent A2LA-ISO-17025 Test Laboratories with facilities in the Los Angeles (Anaheim),Baltimore/Washington DC (Linthicum Heights) and Europe (United Kingdom) specializing in testing of PBB's, Electronics, coatings & materials
Polyimide Film Stiffener ( Brown/Black) Halogen free Polyimide film stiffener is made of high heat resistant and high adhesive adhesive coating on PI film substrate,and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to e
Aerosol 1 gallon pail 5 gallon Pail 55 gallon Drum Medium-Strength Defluxer/Degreaser Slower Drying for "Vanishing Oil" Lubrication Absolutely Plastic-Safe 100% VOC Exempt ZERO VOCs Excellent Toxicity Ratings Dissolves Silicone Residues, Silic
Lite Fast 3010-M is a low viscosity, one-component conformal coating. It was specifically developed for printed circuit boards (PCBs) as well as hybrid and integrated circuits for military application. Low viscosity enables the resin to flow betwee
Used SMT Equipment | Adhesive Dispensers
Screw , nut and bolt coating machine TH-2004l3 Features: Thread locking sealant equipment are a cost effective and superior alternative to lock washers, locking threads, and studs. Prevent loosening due to vibration or thermal expansi
The Polyonics polyester tapes offer effective, low cost materials for those applications involving lower temperatures and less harsh environments. The excellent electrical, thermal and mechanical properties of polyester combined with Polyonics proven
The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics
CGS HN polyimide film has been used successfully in applications at high temperature. It can be laminated, metallized, punched, formed or adhesive coated. CGS has 1mil, 2mil, 3mil, 5mil and 10 mil HN polyimide films. CGSTAPE-7258 (1mil) - 1 mil
Technical Library | 2009-09-09 15:08:19.0
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.
Technical Library | 2018-12-26 10:31:05.0
The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding environments with respect to temperature extremes, mechanical stresses and/or production limitations. Adhesives are playing an increasingly significant role in the continuously evolving electronics industry. (...)Specific applications will be presented that highlight the feasibility of the technology with respect to conductivity, structural reliability and lifetime standards. The deposition of the novel ICA has been performed using a jet printing technology to ensure both precise and accurate positioning, size and volume delivery.
