Used SMT Equipment | Screen Printers
Ekra Type model – X5 Serial-Number – X5 01089 Alignment Repeatability - +12.5 µm@6sigma Printing speed - 9mm/sec to 200mm/sec Printing pressure – 0kg to 26kg Frame size – 736mm*736mm*38mm Pr
Industry News | 2018-02-14 10:19:15.0
Press Release DA 90 Low Temperature Die Attach Adhesive Series Materials
Industry News | 2018-02-14 10:21:37.0
Press Release DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials
The Polyonics polyimide tapes combine the unique electrical, thermal, chemical and mechanical properties found in polyimide with Polyonics proven coating, adhesive and manufacturing technologies. The tapes maintain these excellent properties over a w
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
Technical Library | 2020-03-26 14:55:29.0
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic microtopographic 3D imaging of challenging objects that are difficult or impossible to scan with traditional methods, such as machine vision or laser triangulation.Examples of well-suited applications for line confocal technology include glossy, mirror-like, transparent and multi-layered surfaces made of metals (connector pins, conductor traces, solder bumps etc.), polymers (adhesives, enclosures, coatings, etc.), ceramics (components, substrates, etc.) and glass (display panels, etc.). Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory. The operational principle of the line confocal method and its strengths and limitations are discussed.Three metrology applications for the technology in electronics product manufacturing are examined: 1. 3D imaging of etched PCBs for micro-etched copper surface roughness and cross-sectional profile and width of etched traces/pads. 2. Thickness, width and surface roughness measurement of conductive ink features and substrates in printed electronics applications. 3. 3D imaging of adhesive dots and lines for shape, dimensions and volume in PCB and product assembly applications.
Industry News | 2022-11-08 14:43:06.0
YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category! This ceremony took place on Wednesday, November 2nd at SMTAI 2022 Exhibition in Minneapolis, USA.
Ultimate performance with a small footprint Multi-piston dispensers are used for the output of large batch quantities and for short cycle times. These systems can pot several workpieces in a single potting cycle. They are particularly suited for pot
Industry News | 2018-02-08 09:25:01.0
IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732
Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
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