Industry News | 2010-04-16 16:30:20.0
DENVER — Krayden Inc., a leading distributor of engineered adhesive, sealants conformal coating and lead-free solder products, announces the addition of Gary Buckner to the Dallas Fort Worth Area Sales Team.
Industry News | 2008-11-18 17:11:36.0
DENVER � November 2008 � Krayden, Inc., a leading distributor of engineered materials, along with Dow Corning, a global leader in silicone technology, introduce a new family of products for the LED marketplace.
Industry News | 2009-01-16 17:14:22.0
FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009
Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
Industry News | 2018-02-14 10:15:17.0
Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA
Industry Directory | Manufacturer
The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.
Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Industry News | 2010-06-04 17:36:28.0
DENVER — Krayden, Inc., a leading distributor of engineered materials, introduces the Permabond TA459 magnet adhesive that is non-corrosive to electrically conductive surfaces including copper.
Industry Directory | Distributor
Bodo Moeller Chemie offers solutions for the automotive industry, bonding adhesives and the construction industry in USA. The subsidiary in the USA has also been ISO 9001 certified since 2018. Find us on LinkedIn and Facebook
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
