Full Site - : coating entrapped (Page 2 of 4)

Solder Ball Criteria

Electronics Forum | Fri Oct 23 15:43:31 EDT 2009 | seankim10

According to 5.2.6.1, it states that defected if Solder balls are not entrapped in no-clean residue or conformal coating. How do you define entrapment or how do you assess if the balls won't dislodge under normal product service environment? The sold

Conformal Coating Coverage on Side of IC

Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef

10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg

Referee Call on Solder Balls

Electronics Forum | Thu Jan 31 13:01:33 EST 2013 | kmots15

Defect if its not coated. Defect - Class 1,2,3 • Solder balls are not entrapped, encapsulated or attached or can become dislodged in the normal service environment. • Solder balls violate minimum electrical clearance.

Conformal Coating

Electronics Forum | Thu Nov 30 21:30:00 EST 2023 | ritronusa

Having issues with getting the right formula for a GPD simplecoat machine. We tried a silicone that hardened in our lines and when we try acrylic it is either showing air entrapment or cobwebbing.

BGA underfill necessary with conformal coat?

Electronics Forum | Wed Mar 27 18:23:01 EST 2002 | kmorris

Does anyone have experience doing conformal coating over Plastic BGA in High-Rel PCB assembly? Is underfill necessary to avoid problems with entrapped air, etc? Our application is a 17x17mm BGA, 256 I/O. We are assembling with a water soluable pas

Re: Trapped Flux Under Component

Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F

Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu

BGA underfill necessary with conformal coat?

Electronics Forum | Wed Mar 27 21:20:30 EST 2002 | davef

There is two major BGA coating camps. * Camp #1: "We require the coating to be under low stand-off devices but with no filleting. So we apply a thinned dip coat first, and then top-off with a proper spray coat" * Camp #2: "We want no coating under th

No Clean for BGA's

Electronics Forum | Wed Oct 02 12:06:59 EDT 2002 | dragonslayr

Scott - all sounds good. My primary concern is the residual flux left behind under the BGA. Will moisture entrapment become a concern over time? I believe that may be dependent on the flux formulation. I know that some no clean fluxes actually become

Coating under Mil connector....

Electronics Forum | Thu Dec 22 21:29:05 EST 2005 | davef

Josh: Room Temperature Vulcanizing (RTV) is Dow Corning's trade name for it's family of silicone cure sealants. RTV is about the worst kind of coating there is. Its chemistry is highly ionic and it requires atmospheric humidity absorbed to "complete

Re: Questions regarding rework

Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F

1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu


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