The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
Electronics Forum | Wed Jan 27 09:00:56 EST 1999 | Chris Fontaine
| | I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the
Electronics Forum | Thu Nov 19 22:48:22 EST 2009 | davef
Since the bubbles: * Are only on the solder connection, we'd guess there must be some compatibility issue between the flux residues and the conformal coat materials. * Occur after curing, we'd guess the cure recipe is too rapid and is entrapping voli
Industry News | 2017-10-02 13:58:42.0
GPD Global will exhibit at the upcoming IMAPS 2017. At booth 244, GPD Global will exhibit a complete line of Fluid Dispensing pumps with the latest dispense technologies for integration or retrofit. Whether your process requires low or high viscosity fluids, thick pastes, or abrasive media, there is a dispense pump to meet your requirements.
Industry News | 2010-10-11 14:57:11.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 4 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
GPD Global | https://www.gpd-global.com/co_website/dispense-retrofit-imaps.php
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