Electronics Forum | Fri Dec 09 02:20:47 EST 2005 | Mike_Kennedy
Grant, I dont quite understand the implications my self yet on gold deposit using FLASH or ENIG. However the important part of the gold finish is that it is kept under 3% of the total solder joint, so normally its safe. With the FLASH process it is m
Electronics Forum | Tue Nov 15 16:57:22 EST 2005 | bk
If your problem is happening part way through the calibration the problem might be there is too much friction from your Y-wagon. Measure the friction on the Y-wagon using the service program if it fails or if it is near the max allowed try oiling up
Electronics Forum | Fri Jun 09 05:18:07 EDT 2006 | Rob
Hi Shawn, that you're baking the components makes me think that they are either old, or have been sitting around for a while (or none of the above & you are really dilligent!) Whilst baking will sort out the MSD issues (such as popcorning) it will
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
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