Features: For the automatic pcb cutting equipment developed for the COB light source board, the microcomputer is used to control the automatic feeding board. Suitable for PCB board, aluminum substrate, copper board slitting. Widely used in auto
Industry News | 2010-05-04 08:04:45.0
After the highly successful introduction of its SIPLACE SX1 and SX2 placement machines featuring swappable gantries (“Capacity-on-Demand”), Siemens Electronics Assembly Systems will unveil the new SIPLACE SX4 at the SMT/Hybrid/Packaging trade show in Nuremberg, Germany (June 6-8, 2010; Hall 7, Booth 204).
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
NSW Automation design and manufacture fluid dispensing system and solutions. Dispensing process is achieved by various delivery method (dotting, casting, sealing, filling, jetting etc) to meet process requirements. Application range from LED, COB, Se
Industry Directory | Manufacturer
Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Leading optoelectronics companies are looking to PROMEX for their outsource manufacturing needs. Our core competencies in microelectronics assembly technologies compliment our thorough understanding of high-speed circuit layout and process engineerin
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of highly miniaturized and high reliability PCBs. Swiss Quality substrates for demanding applications such as implants and medical devices. HDI flex, rigid-flex and rigid PCBs in small to medium volumes.
MAX Series High Precision Dispensers Available for Heated & Non-Heated Applications The MAX Series is the premier line of GPD Global high precision dispensers. This dispense equipment can process a wide variety of dispense applications: MicroVolu
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
