Electronics Forum | Wed Mar 14 00:48:35 EDT 2012 | lalitjadiya
I want to design COB for my calculator program.I want to know the process details,minimum quantity required,cost defining factors,all other details.Someone please help to get the details.
Electronics Forum | Wed Sep 26 12:31:02 EDT 2001 | nifhail
Let's assume that SMT or MEMS or COB etc, is a new things and about to be introduced to the line, nobody knows about this new process and I was asked to select the critical proceses and parameter, how and where should I start? Thanks and best rega
Electronics Forum | Tue Nov 24 13:55:17 EST 1998 | trien pham
I have a COB device that I need to decapsulate for failure analysis. I would like to find out how I can do it using common materials/process that I can easily find. Thank you and I look forward to hearing from you soon.
Electronics Forum | Thu Jan 20 09:30:09 EST 2005 | russ
That's what I thought it was. We may very well contract this out. We don't have underfill capability and the volumes may not warrant us investing. Do you know of someone doing this? I don't know at this time if it is the flip chip or the wire
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Wed Jan 19 18:29:40 EST 2005 | russ
Anybody out there that can give me the basic details about Chip on board and the manufacturing process to place these parts onto assemblies? Any special equipment/processes required? We are a contract manufacturer and have been asked to implement. I
Electronics Forum | Thu Feb 19 00:31:55 EST 1998 | Larry
The type of training I am looking for is things like micro BGA, flipchip, COB, new processes and techniques, ect. I already work with things like fine pitch QFP's, high mix double reflowed boards every day. I live in Vancouver, but I can drive to Sea
Electronics Forum | Mon Dec 07 17:56:45 EST 1998 | Tom Braswell
I have been put incharge of developing a process to rework a doublesided SMT PCB with DCA/COB (direct chip attach, chip on board ) components. The rework will consist of removing some 603-1206 chips on both sides of PCB, oh yeah its has a polyuretha
Electronics Forum | Wed May 18 08:18:55 EDT 2005 | kvanzill
Yes we have purchased a second machine due to low through put so he will be here on the 6th of June....I will be involved with training then, but so far I have not seen great support from this company as far as thier own knowledge of some problems th
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