Industry Directory: coefficient (5)

Master Bond

Industry Directory | Manufacturer

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds. Master Bond specializes in epoxies, silicones and uv curable polymer systems.

CSM Instruments

Industry Directory | Manufacturer

CSM Instruments develops, manufactures and sells instruments to characterize mechanical properties of surfaces. We have been the world leader in this market for more than 30 years.

New SMT Equipment: coefficient (60)

Standard Tribometer (TRB)

Standard Tribometer (TRB)

New Equipment | Other

The control of friction and wear in moving machine parts is a critical issue facing all manufacturers. It can be crucial to have quantitative data obtained at varying humidity and temperature and in the presence of lubricants. CSM Instruments Tribome

CSM Instruments

ceramic capacitors offer voltage ratings from 25V-5000V

ceramic capacitors offer voltage ratings from 25V-5000V

New Equipment | Other

1000 (DF400+20C (Q=1/DF) X7R : D.F NPO Materials.; size case : 0805,1206,1210,1808,1812;===> X7R materials ; (2)Capacitor Arrays: capacitor arrays combine spearate multi-layer ceramic capacitor of hte same value in a single passive component, the pr

Pluspark Electronics technology Co.,ltd

Electronics Forum: coefficient (51)

low thermal emf solder & paste - SAC 405

Electronics Forum | Tue May 13 08:59:13 EDT 2014 | gazelle

Hello davef - could it be you are confusing low thermal emf (Seebeck coefficient) with low temperature solder ? I am looking after solder wire and paste with low Seebeck coefficient - cadmium based alloy was OK but banned in europe due to RoHs direct

Polyamide

Electronics Forum | Mon Feb 15 14:30:00 EST 1999 | Dave Turner

| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc

Used SMT Equipment: coefficient (16)

Ekra X5

Ekra X5

Used SMT Equipment | Screen Printers

Ekra   Type model – X5 Serial-Number – X5 01089 Alignment Repeatability -  +12.5 µm@6sigma Printing speed -  9mm/sec to 200mm/sec Printing pressure – 0kg to 26kg Frame size – 736mm*736mm*38mm Pr

Ekloo Bis

Hexi Wave solder machine with nitrogen

Hexi Wave solder machine with nitrogen

Used SMT Equipment | Soldering - Wave

this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor

Hexi Electronic Equipment Co.,Ltd

Industry News: coefficient (53)

New Reference Guide from Schaffner Provides Comprehensive RF Immunity Test Information for Engineers

Industry News | 2003-03-10 08:41:03.0

provides an overview of the main features of both conduction coupling and radiated field coupling, the two primary RF immunity test methods.

SMTnet

IPC Releases E-Textiles Standard IPC-8921

Industry News | 2020-01-07 11:09:15.0

IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.

Association Connecting Electronics Industries (IPC)

Technical Library: coefficient (16)

Effects of Tg and CTE on Semiconductor Encapsulants

Technical Library | 1999-07-21 08:49:49.0

As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability.

Henkel Electronic Materials

Optimizing Thermal and Mechanical Performance in PCBs

Technical Library | 2008-02-04 12:13:38.0

Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.

Stablcor

Videos: coefficient (4)

High Quality High Speed FPC/PCB UV Laser Cutting Machine

High Quality High Speed FPC/PCB UV Laser Cutting Machine

Videos

355nm 10W /15W High-Precision CCD FPC/PCB UV Laser Cutting Machine With Perfect CAM interface, it supports the mainstream of the drilling and milling file format; man-machine interface is friendly; optical path is sealed, and it also has stable an

YUSH Electronic Technology Co.,Ltd

Brand new and original

Brand new and original

Videos

>>CONTACT  MAC  NOW Email: at@mooreplc.com Mobile: +8618020714662(WhatsApp) Skype: +8618020714662 >>>CONTACT  MAC  NOW ✦ Quick      Details ✦ Input Range -20 mA to +20 mA Resolution 0.8 microamps Over-Range Limits From -22 to +22 mA (+/-

MOORE Automation Ltd.

Express Newsletter: coefficient (19)

Partner Websites: coefficient (37)

PCB Libraries Forum : Determine Hole Size for Plastic Peg Alignment Pins

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_determine-hole-size-for-plastic-peg-alignment-pins_topic720.xml

.   The CTE (Coefficient Thermal Expansion) relates to the PCB expansion in the "X" axis or board length and width. Or the linear dimensional change of material per unit change in temperature.  

PCB Libraries, Inc.

FR-4 vs. Rogers Material for Manufacturing RF PCBs | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/fr-4-vs-rogers-material-for-manufacturing-rf-pcbs/

. Thus, several variables must be considered with choosing RF PCB materials: Coefficient of Thermal Expansion (CTE) To serve their purpose, RF PCBs need to be able to operate in high-temperature applications

Imagineering, Inc.


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