Technical Library | 2009-02-26 03:25:09.0
STI has developed a patented1 packaging technology coined Imbedded Component/Die Technology (IC/DT®) to integrate multiple subsystems within an electronics assembly into a single, advanced, high-density assembly. Imbedded Component/Die Technology (IC/DT®) enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density CCAs through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management
Technical Library | 2023-03-16 19:07:51.0
HISTORY: * In the late 1970s an abrupt unpredictable loss of insulation resistance was observed in PCBs, which were subject to hostile climatic conditions of high relative humidity and temperature while having an applied voltage. * The loss of resistance, even leading to a short circuit was observed to be due to the growth of a subsurface filament from the anode to the cathode. * The term "Conductive Anodic Filamentation" (CAF) was coined.
Wireless connectivity is fast becoming recognized as a flexible and reliable medium for data communications across a broad range of applications. In vending machines and on-location sales equipment, embedded transceivers can send alerts when replenis
Industry News | 2020-12-10 14:14:49.0
New Yorker Electronics Introduces Illinois Capacitor Rechargeable Batteries for IoT Devices, Wearable Electronics and Memory Backup Circuits
Antennas exist in all communication equipment and in a broad range of electronics. The industries that use antennas range from telecom to medical industry to military applications. Current antennas are much smaller than previous generations and, in m
A spring contact is any part that is used to connect, or keep distance between, two separate parts. These parts can be used to transfer current between the power source and the load on a circuit board. There are a wide variety of applications for suc
Industry News | 2007-11-01 20:29:37.0
November 1, 2007 - Lloyd Doyle announces they will showcase the IBIS system, a brand new development for solder bump inspection, in Hall A1 Stand 347 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry Directory | Manufacturer
Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001
Single-chip ultra low power CMOS RF Transceiver for the 315/433/868/915 MHz SRD Band. It has been specifically designed to comply with the most stringent demands of the low power radio market. The CC1000 operates from 2.1 - 3.6 V making it ideal fo
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
