Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Mon Jul 01 13:38:01 EDT 2013 | emeto
I am also not sure if the Electrolytic capacitor has a "flat lug leads". I think it is more like a coined lead. I hope other experts can advice.
Electronics Forum | Fri Jun 29 07:47:16 EDT 2012 | mosborne1
Dave Thanks for the input. The thermocouple read 244 on the pad of the socket. We actually found after extensive investigation that it is the coplanarity of the leads. We were shipped a bad batch of sockets form the manufacture. Go figure!!1
Electronics Forum | Sun Feb 24 09:10:47 EST 2019 | spoiltforchoice
That is what eSims are for.... For everything else use a socket
Electronics Forum | Mon Sep 23 01:42:35 EDT 2019 | sssamw
yes, socket on PCB, SMD type
Electronics Forum | Wed Jun 27 11:13:44 EDT 2012 | mosborne1
We are seeing PLCC socket leads not soldered in our SMT process. We are using a KIC thermal profiling device and we are on 50% greem light process window. All other solder joints on the board looks great. The solder flowed what looks like perfect on
Electronics Forum | Thu Aug 21 21:05:39 EDT 2003 | Tom B
Dan, We, do alot of double reflow. Your right we typically see alot of the standards components, SOT's, SOIC's, Chip stuff. The largest we do with out adding epoxy is some 32pin PLCC's. We have several assemblies were were doing PLCC44's, Sockets
Electronics Forum | Fri Nov 03 11:30:29 EDT 2017 | davef
regarding dwl comment, "For low volume hand assembly, deionized water or IPA should work fine." Deionized water: Deionized water is corrosive. It needs to be removed. Proof? Drop a copper coin into a covered jar of DI water and watch what happens ov
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Fri Mar 19 16:56:42 EDT 2010 | cisridn
Both the coin and the device flange that is soldered to the coin have a gold finish. A solder preform is placed in the pocket of the coin before the device is placed prior to reflow. Solder adhere's to both surfaces
