Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
Industry News | 2011-03-11 14:47:03.0
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.4mm pitch 221 ball BGA - SG-BGA7162. The socket operates at bandwidths up to 10 GHz with less than 1dB of insertion loss.
Industry News | 2011-01-12 15:27:11.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.
Industry News | 2011-03-22 16:23:31.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.
Accept a device and either plug into an EPROM emulator or production socket or solder down to a land pattern. Available for DIP, PLCC, SOIC and QFP packages.
Plug into a DIP socket and provide a land pattern for soldering down an SOIC or SSOP device. Use to replace unavailable packages.
Industry Directory | Manufacturer / Manufacturer's Representative
iTECH II provides a broad range of SMT and PTH assembly solutions to meet a wide range of Customer applications.
Industry News | 2007-11-01 20:29:37.0
November 1, 2007 - Lloyd Doyle announces they will showcase the IBIS system, a brand new development for solder bump inspection, in Hall A1 Stand 347 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry Directory | Manufacturer
Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001
