Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
http://www.flason-smt.com/product/Online-Automated-AOI-Machine.html Online Automated AOI Machine Z588 Inspection Component: 01005 chip PCB size::50×50mm-330×400mm Dimension:950mm×1000mm×1580mm Weight: 670kg Product des
http://www.flason-smt.com/product/PCB-Inspection-Online-AOI-Machine.html PCB Inspection Online AOI Machine Z588 Inspection Component: 01005 chip PCB size::50×50mm-330×400mm Dimension:950mm×1000mm×1580mm Weight: 670kg P
Used SMT Equipment | Labeling Systems
CBP / TP 5Kg Cold Bump Pull/ Tweezers Pull Cartridge along with JAW Nordson Dage 4000 Bond Tester DAGE 4000 CBP/TP 5KG Qty:2 Condition : Excellent working condition with many Modules all form Europe user Email:13560819457@139.com
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Technical Library | 2019-05-08 21:52:28.0
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | Littleton, CO USA | Production
Possess 18 years relevant work experience in manual/Auto bonding on Micro-Electronic & RF to support new product development in R&D Lab in defense & commercial sectors. Have an advanced soldering skill in both Through-Hole/SMT, and J-STD-001 cert
Career Center | , | Engineering,Production,Quality Control,Research and Development
WORK EXPERIENCE Hutchinson Technology Incorporated, MN Feb.2006-Present Process Development Engineering Co-op �Study of voids generation in solder ball bonded Cu substrate with Ni/Au metallization. �Diffusion & Intermetallic growth study in sold
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
Heller Industries Inc. | https://hellerindustries.com/parts/4004/
4004 - Conceal Pull Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/3D-STEP_SM-Active.asp
. << Back to Categories Aluminum Electrolytic Capacitor (CAPAE) Ball Grid Array (BGA) no login required Micro BGA Ceramic Flat Package (CFP
