Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.
a cooling preparation used to find failures with thermal method, provides quick cooling down to the temperature of �67�C, by proper usage it allows us to locally cool down assemblies, the preparation is perfectly suitable for finding �cold solderings
IKEUCHI's AKIMist"E" Dry Fog Humidification System provides uniform stable humidity, and expect the following effects. 1. Prevents ESD damege, static issues(Ex. Picking Failure) 2. Stable screen printing performance by keeping solder paste in goo
Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval
A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Technical Library | 2020-12-10 15:49:40.0
Electronic assemblies should have longer and longer service life. Today there are partially demanded 20 years of functional capability for electronics for automotive application. On the other hand, smaller components, such as resistors of size 0201, are able to endure an increasing number of thermal cycles until fail of solder joints, so these are tested sometimes up to 4000 cycles. But testing until the end of life is essential for the determination of failure rates and the prognosis of reliability. Such tests require a lot of time, but this is often not available in developing of new modules. A further acceleration by higher cycle temperatures is usually not possible, because the materials are already operated at the upper limit of the load. However, the duration can be shortened by the use of liquids for passive tests, which allow faster temperature changes and shorter dwell times because of better heat transfer compared to air. The question is whether such tests lead to comparable results and what failure mechanisms are becoming effective. The same goes for active temperature cycles, in which the components itself are heated from inside and the substrate remains comparatively cold. This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | Oakville, Ontario Canada | Production
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-in-automotive-components-are-revolutionizing-the-industry/
. For example, manufacturers must design automotive power supplies to handle load dumps, cold cranks, reverse polarity, and double battery jumps equally
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