Industry Directory | Manufacturer
Jinan Scientific Test Technology Co., Ltd. is a high technology manufacturer and designer devoting on researching and developing, sales and service of material testing instrument in Jinan city, China.
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
We manufacture and export CXT Cable Glands with features including Easy installation, Designed to prevent Cold flow and Displacement type seal. CXT Cable Glands are available with Screened Flexible (EMC) Wire Braid (e.g. CY / SY), Wire Braid Armour C
Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval
A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'
Electronics Forum | Mon Dec 18 22:36:37 EST 2000 | Charles Harper
The major problems are poor layer to layer bond strength(due to surface tension of most fluoropolymers),and poor cold flow,or dimensional creep of these materials.Please also click on Chapter Author Konsowski,listed above.E-mail form will pop up when
Used SMT Equipment | In-Circuit Testers
Fast Ramp ESS temperature chamber: Perfoms 5C to 25C per minute +125C to -20C based on 400lbs of aluminum and 1500 watts live load. Can be modified to perform -40C. Interior Dimensions: 2.14M X 2.14M X 2.14M / 7 feet X 7 feet X 7 feet. Elect
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
https://www.ascen.ltd PCB rotation conveyor PCB turn conveyor|180 degree or 90 degree turning rotational transport change PCB side direction output reflow oven for processing.auto PCB turn conveyor and PCB diverter changing the PCB conveying direct
https://www.ascen.ltd PCB rotation conveyor PCB turn conveyor|180 degree or 90 degree turning rotational transport change PCB side direction output reflow oven for processing.auto PCB turn conveyor and PCB diverter changing the PCB conveying direct
Career Center | RACINE, Wisconsin USA | Sales/Marketing
Business Development Leader • Experienced business leader in-depth knowledge in techincal industries, candid communicator. • Expertise in building and expanding client base, increasing name recognition and market share using a wide array of tools,
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/flux.pdf
). Cooling air from outside the oven cools the external surfaces of the condenser tubes. The flow direction of the cooling air is opposite the direction of the flux vapor flow to provide the most efficient cooling
| http://etasmt.com/te_news_bulletin/2021-08-31/23762.chtml
. The velocity of the exiting nitrogen is governed by the simple relationship: M=VxAxD where M= mass flow, V= gas velocity, A= the area the gas flows through, and D =gas density
