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Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon

| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con

How to prevent BGA issue of SMT solder resist when fabricate PCBA

Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3

To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads

Conversion of gerber data into .lst, .aoi, .srf or .asc formats

Electronics Forum | Sun Sep 03 10:05:36 EDT 2017 | unisoft

Hi Unisoft's ProntoGERBER-CONNECTION should help you. ( http://www.unisoft-cim.com/gerber_connection.htm ) -------------- ProntoGERBER-CONNECTION ( http://www.unisoft-cim.com/gerber_connection.htm ) imports raw Gerber data and allows the user to ad


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