Electronics Forum | Wed Sep 25 06:56:16 EDT 2002 | CH
U may check your profile ramp rate. The flux may evporated and look like cold joint
Electronics Forum | Mon Mar 01 10:27:08 EST 2010 | wrongway
I don't think I would reduce the heat at all if there is no vibration in your oven or on the chain you should have no problem with them falling off or moving but you sure don't want a cold solder joint you no the solder joints are so easy to see go
Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
Electronics Forum | Fri Apr 10 13:25:21 EDT 1998 | Jon Medernach
| Is there a good way to inspect BGA | balls ? Is there an inspection piece | of equiip.? The idea is to develope a process that eliminates insoection. BGA's, by the nature of the design, do not lend themselves to inspection. Even X ray is subjec
Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau
Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe
Electronics Forum | Tue Nov 06 07:34:26 EST 2007 | scottp
I'm not sure what kind of marginal joint you're trying to identify, but when we went through a serious ball-in-cup problem a few years ago we tried hot & cold functional test as well as a day or two of -40/+125C thermal cycling and all were pretty po
Electronics Forum | Thu Jun 19 10:47:29 EDT 2003 | Eric QE
Caltex or Ersa type system is good, Caltex prisms, necessary for looking underneath the BGA can be crashed easily when looking under low profile or Micros. $40-$110 each depending on the availability and who makes 'em. We have 2D and 3D X-ray avai
Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip
Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an
