Industry News | 2009-03-10 15:56:35.0
San Diego � January 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will introduce Reflow Process Inspection (RPI) in booth 2258 at the APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2009-04-08 19:05:40.0
San Diego � March 2009 � KIC announces that it has been awarded a NPI Award in the category of Process Control Tools for its RPI in-line inspection system. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Industry News | 2009-05-13 21:01:07.0
San Diego � May 2009 � KIC announces that it has been awarded the 2009 EMAsia Innovation Award in the category of Process Control Software for its RPI in-line inspection system. The award was presented to the company during an April 22, 2009 ceremony that took place at the Shanghai Everbright International Hotel during Nepcon China 2009.
Industry News | 2009-09-17 14:57:44.0
San Diego — September 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will feature Reflow Process Inspection (RPI) in booth 830 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.
New Equipment | Assembly Services
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
