Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Rework & Repair Equipment
FEATURES For optimization - Solder Jr series supplies solder wire with just one click, which allows you to easily adjust quantity and delivery speed. Soldering quality will be stabled and enhanced due to the fixed solder amount for each point. Pe
New Equipment | Test Equipment - Bond Testers
Easy and automatic CBP cavity cleaning with no mechanical jaw contact. During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is
New Equipment | Assembly Services
At the stage where production PCB assembly is being planned, many other factors come into play, particularly Design-for-Test (DFT) and Design-for-Manufacturability (DFM) issues, making sure documentation is current, planning diagnostics tests and mac
New Equipment | Soldering Robots
Highly Flexible In Insertion Angles. Vertical inline soldering robot, UNIX-700FV is an ideal for irregularly shaped works into which is hard to insert the tip. The vertical multi-joint is utilized to freely change the head angle and quick operation.
Bob Willis "How to Do It" video clip explains how to test solderability of terminations in a production environment in a few seconds. The test is simple and show if a process problem you are facing is related to process, components, paste or other fa
Industry News | 2011-09-21 12:22:09.0
Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
New Equipment | Cleaning Agents
KYZEN® E5615 is an aqueous based cleaner designed to be the fastest drying chemistry in the industry. E5615 is shipped ready to use and successfully removes unreflowed solder paste from stencils and related equipment. Fast Drying No Rinse Require
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
