Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
New Equipment | Solder Paste Mixers
Unique contoured shape, generous appearance and practical, which is made by advanced coating process workmanship. Mixing principle is on the basis of Motor rotation and revolution mode of agitation, no need to defrost the paste. Need to recovery the
Technical Library | 2009-05-07 23:23:00.0
Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed.
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
The Thermaltronics Robot System incorporates innovative design concepts and precision components to ensure accuracy. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs. 8
Industry News | 2011-11-10 19:20:07.0
Multitest announces that its Cantilever style contactors often are used on non-Multitest, third-party test handlers.
New Equipment | Board Handling - Storage
75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
Industry News | 2018-11-27 14:06:32.0
Valtronic is pleased to announce the addition of two new machines for use in production: Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI).
The printer series GL and PMAXII provide more features than all other printers available in the market. Additionally, free software upgrades throughout the printer's lifetime are available. This proven quality product offers unequalled opportunities
