75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
Industry News | 2018-12-18 20:58:42.0
Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Technical Library | 2023-11-06 17:08:44.0
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.
EMST Stallion PLC TT-JW is a new table top wave soldering machine from EMS Technologies, the soldering specialists. After the world wide success of the previous table top model, EMST Stallion, it is upgraded from manual controls to PLC based control
Industry News | 2010-10-26 22:46:06.0
FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.
Industry News | 2013-05-01 11:03:43.0
FCT Assembly today announced that it won a major OEM in the Northwest with its NL932 lead-free no-clean solder paste. The OEM evaluated six solder paste suppliers.
Technical Library | 2021-01-28 01:55:00.0
Printed circuit board surface finishes are a topic of constant discussion as environmental influences, such as the Restriction of Hazardous Substances (RoHS) Directive or technology challenges, such as flip chip and 01005 passive components, initiate technology changes. These factors drive the need for greater control of processing characteristics like coplanarity and solderability, which influence the selection of surface finishes and impact costs as well as process robustness and integrity. The ideal printed circuit board finish would have good solderability, long shelf life, ease of fabrication/processing, robust environmental performance and provide dual soldering/wirebonding capabilities; unfortunately no single industry surface finish possesses all of these traits. The selection of a printed circuit board surface finish is ultimately a series of compromises for a given application.
Industry News | 2019-12-16 22:05:41.0
In recent years, as a subdivision of the LED industry, UV LED industry has developed in full swing. In 2019, the UV LED industry is in the buffer phase of application explosion, and the most urgent task for relevant companies is to launch the technology war, in order to capture as many places as possible before the real market explosion.
Industry News | 2014-10-22 11:11:30.0
Kurtz Ersa North America announces that it has delivered the new ERSASCOPE 2 to ACME PCB Assembly.
The “PTP® VP-8” is a complete thermal profiling solution for the vapor phase solder process, using the award winning, M.O.L.E.® MAP software, in combination with the German-Engineered PTP® Vapor Phase profiler. This match-up provides all the power &
