Full Site - : cold solder-joint (Page 12 of 16)

Solder joint issue

Electronics Forum | Thu May 18 11:00:51 EDT 2006 | Chunks

Thanks Doctor - as always, you're right. I must've been typing with my mittens on. It's starting to get cold on this part of the planet these days. I wasn't blaming anyone, just trying to take a few questions marks away so "we're" left with the an

Thermal screening for marginal BGA joints

Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau

Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe

Re: Void in solder bump

Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon

| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat

Vapor phase versus forced convection

Electronics Forum | Wed Aug 18 00:53:16 EDT 2004 | Grant

Hi, I think you cannot go wrong with Convection. If you want to experiment with VP, just get some of the fluid and put it into a pasta cooker on a standard domestic hot plate. Have a basin full of cold water so after reflow you can lift the cooker a

Re: Shielding

Electronics Forum | Thu Mar 04 17:10:19 EST 1999 | Earl Moon

| Our vendor proposed to supply us with shields made out of Cold Rolled Steel (CRS) electroplated with Sn (50 - 150 minches). Should I be concerned with solderability or are there a better alternatives to tin finish? | No matter the base metal, elec

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip

Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm

Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate

Lead Free paste

Electronics Forum | Mon Nov 20 13:35:52 EST 2006 | cuculi54986@yahoo.com

We evaluated the OM338 from Alpha and it worked great! Looked like crap, though, compared to the other products out there. When I set the boards out in front of the Alpha sales guy to show him the difference in appearance between his boards and the

Re: Suspect BGAs

Electronics Forum | Tue Mar 16 18:27:34 EST 1999 | Earl Moon

| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it

Re: High-Temp solder for thermocouples

Electronics Forum | Thu Dec 17 10:22:31 EST 1998 | Earl Moon

| Necessity is the mother of invention... | | The other day I loaned my last bit of high-temp solder to a co-op and never saw it again. Then I had to run a profile and I was in a pickle with no solder. | | So I ran out to the local Radio Shack to


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