Technical Library | 2020-12-10 15:49:40.0
Electronic assemblies should have longer and longer service life. Today there are partially demanded 20 years of functional capability for electronics for automotive application. On the other hand, smaller components, such as resistors of size 0201, are able to endure an increasing number of thermal cycles until fail of solder joints, so these are tested sometimes up to 4000 cycles. But testing until the end of life is essential for the determination of failure rates and the prognosis of reliability. Such tests require a lot of time, but this is often not available in developing of new modules. A further acceleration by higher cycle temperatures is usually not possible, because the materials are already operated at the upper limit of the load. However, the duration can be shortened by the use of liquids for passive tests, which allow faster temperature changes and shorter dwell times because of better heat transfer compared to air. The question is whether such tests lead to comparable results and what failure mechanisms are becoming effective. The same goes for active temperature cycles, in which the components itself are heated from inside and the substrate remains comparatively cold. This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
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How to Solder a Surface Mount Device to a PCB Pad
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The innovative VPI-1000 optical inspection system is the only benchtop SMT inspection system capable of inspecting BGA devices as standard, without necessitating a lengthy lens reconfiguration.
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The basic principle of a press-fit connection is that a contact terminal is pressed into a printed circuit board (PCB). There are two types of press-fit pins – the solid pin with a solid press-in zone and the compliant pin with an elastic press-in zone. In this article, we’ll discuss the elastic press-in zone.
Industry News | 2021-05-21 03:59:59.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.
Industry News | 2024-06-10 10:01:31.0
Amtech Electrocircuits announces the ongoing success of its robust vapor phase technology. With more than a decade of proven success, its vapor phase technology continues to meet and exceed the demanding requirements of modern electronics manufacturing, consistently attracting new customers.
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