Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Fri Apr 10 13:25:21 EDT 1998 | Jon Medernach
| Is there a good way to inspect BGA | balls ? Is there an inspection piece | of equiip.? The idea is to develope a process that eliminates insoection. BGA's, by the nature of the design, do not lend themselves to inspection. Even X ray is subjec
Electronics Forum | Thu May 22 00:21:27 EDT 2003 | AlCapone
The alternative is by looking at all your components data specs (heat-range), especially pay more attentions to heat-sensitive comps, and fine-pitch comps, odd-form comps, draw a diagram on a separate sheet of paper shown that temperature VS those ca
Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
Electronics Forum | Thu May 10 08:09:52 EDT 2007 | davef
There is no standard for time above liquidus. It is described rather broadly by the solder paste supplier. Reflow Zone: If the temperature is too high, boards may char or burn. If the temperature is too low, cold and grainy solder joints will resul
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Wed Apr 21 12:03:59 EDT 1999 | Michael N.
I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is about
Electronics Forum | Sun Jan 14 16:35:48 EST 2007 | Austin
I have several boards built at various CM's. We have prototype builds with some JTAG failures on BGA's (1-3 failures with qty 3, 1500 pin BGA's). CM's always claim reflow profiles look good. X-ray does not show bridges and they claim it looks good, b
Electronics Forum | Sat May 27 08:58:07 EDT 2000 | Thanas
Hi, I'm new in SMT & confusing to define the soldering defect criteria of cold solder, dry joint & dewetting. & what's the root cause for them ? FYI, I had read the IPC-A-610 rev. B , but doesn't help much. Any advise is very much appreciate. Thanks
