Full Site - : cold solder-joint (Page 10 of 16)

Ruggedized PCB Assembly

Electronics Forum | Wed Nov 21 09:19:09 EST 2007 | Paul M.

Need some opinions from you fine folks. We are building assemblies 90% SMT, 10% TH. Fine pitch and BGA devices, etc. The customer is complaining about cold solder joints (SMT) after about 1 year of use, scattered thru-out the assembly, not consistan

BGA rework clearance

Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs

We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee

Re: Ceramic + Hi-temp solder

Electronics Forum | Wed Apr 21 20:50:26 EDT 1999 | Dave F

| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Thu Apr 16 23:59:45 EDT 1998 | Mike C

| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu

HASL vs. ENIG

Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny

Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).

Bad solder joints

Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf

We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi

Repeated reflows

Electronics Forum | Tue Aug 24 15:05:39 EDT 2004 | Dreamsniper

There is danger in doing this based on theory. Chances of the solder joints becoming cold or having poor wetting due to the fact that during the first run all the flux vehicles had evaporated and with the second run they're no longer present to help

Re: vibration during solder reflow

Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW

| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work

Via in Pad

Electronics Forum | Fri Sep 13 06:18:55 EDT 2002 | yngwie

Here's a long survey....Pls help. 1) What is the general feel for via in pad for upcoming designs? - complete Via in pad - partial encroachment - via partially in pad 2) What are the manufacturing bare PCB's related concerns, issues and possible dr

BGA inspection scope - Visual

Electronics Forum | Thu Jun 12 11:12:08 EDT 2003 | babe

The last statement saying that seeing down the bga component with these systems is useless, is an incorrect statement. First with x-ray you do not see flux residue and or flux migration, second with x-ray you do not see a cold solder joint. Visual i


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