Kent Industrial is specialized at manufacturing surface grinder, including double column machining center, double column surface grinder, vertical machining center and grinding machine.
Industry Directory | Manufacturer / Other
BGA Reballing Services - PBGA, TBGA, CBGA, and CSP reballing services as low as 0.02 cents/individual solder ball attachment. We provide solder column attachment, & tinning, by means of Hot Solder Dipping, for Electrical Components.
Industry News | 2011-09-19 13:31:20.0
STI Electronics introduces its new Micro-Coil Spring Array as an improved alternative to standard rigid arrays.
Industry News | 2023-10-30 19:18:06.0
Martin Hart announces that his recent ground-breaking paper and presentation, titled "Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers", is available on the TopLine web site and is available for free download. It was presented by Hart at IMAPS 2023 in San Diego, California recently.
Technical Library | 2012-01-12 22:51:19.0
In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi
Industry News | 2020-11-17 11:26:03.0
TopLine Corporation will exhibit in the 58th annual IEEE Nuclear and Space Radiation Effects Conference (NSREC), which will have its first Virtual Conference and Exhibition beginning November 29 and accessible through December 30. Live virtual Exhibits will be accessible December 1-8.
Industry News | 2011-11-20 12:48:27.0
STI Electronics has been awarded a Global Technology Award in the category of Components for its Micro-Coil Spring Array.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Used SMT Equipment | In-Circuit Testers
Keithley 7071 8x12 General-Purpose Matrix Card (for Models 707A and 708A) The Model 7071 General Purpose Matrix Card is an 8x12 configuration that switches High, Low, and Guard at each of the 96 relay crosspoints. The eight rows are connected a
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
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