200 Distance Between Two Column (mm) 435 500 565 580 Dimensions of the Machine (mm) Load Frame 120×560×1940 770×600×2130 900×660
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
Surface resistance: 104~106 ohm Overall Size: 850*550*1300mm (Any dimensions and specifications are available on request) Can accommodate 25 pieces of PCB. Each column can accommodate 100 pieces of PCB. The capacity of whole cart is subject to cust
Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource
An electronics magazine circulated in Czech and Slovak Republics with regular columns on design&development, software, manufacturing, components, measurement and testing. Own web portal www.dps-az.cz
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Industry News | 2001-10-23 12:10:36.0
"Radio Shopper" Selects Ron Erickson
Character Liquid crystal displays come in many sizes which is often name by the number of rows and columns. Microtips Technology produces a whole range of Character LCD modules that are used in a wide variety of application areas from fax machines, l
Industry Directory | Media / Publisher / Online Resource
Solution-led technical articles and business information for the SMT and Advanced Packagin industries. Print editions in Europe, United States and China. Global E-newsletter and website, plus regional sites in Japan, China, Hungary and India
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
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