Electronics Forum | Wed Feb 06 07:18:47 EST 2019 | SMTA-Bob
I am looking for some old scrape boards that have either CCGA or CBGA, high temp columns or balled devices for some process experiments I am doing. If anyone has some please let me know, the company name or supplier will not be see or used Many than
Electronics Forum | Fri Jan 13 13:43:51 EST 2006 | russ
As far as I have determined, the Gel and Tacky are the same animal. Just flux works well, I did forget to mention that this flux only method will not work with a CCGA (Ceramic Column Grid Array) since these columns are not meant to be reflowed.
Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu
We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe
Electronics Forum | Mon Aug 09 07:37:33 EDT 2004 | C Lampron
Abraham, Lead free components in a leaded process should not be a problem. The problem increases with leaded components in a lead free process. For the most part, the only difference that you will see is in BGA procesing. If a BGA is lead free, the
Electronics Forum | Fri Sep 17 23:11:30 EDT 2004 | KEN
I have an application that uses 0201 devices coupled with ceramic column grid arrays. The coplanarity of the balls is specified not to exceed 7 mils! 4 mil foil for 0201's with a selective buildup to 7mil for the ceramic. Bloody designers! Take y
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
Electronics Forum | Tue Dec 14 06:41:43 EST 2004 | clampron
Good Morning Everyone, I had a question regarding the use of a lead free BGA in a leaded process. All of the information I have gathered from various seminars state that this is OK. It will process more like a column grid array where the 63/37 will
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon
| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA
Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange
| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic
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