Full Site - : column grid array (Page 7 of 80)

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

IPC International Conference in Budapest Highlights Process Steps for Manufacturing Quality Electronic Products

Industry News | 2011-01-22 00:27:29.0

Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

Design Innovations and Best Practices Featured at IPC APEX EXPO 2011

Industry News | 2011-01-27 15:53:22.0

Providing the latest information on design innovations and best practices, the IPC Designers Forum and several design-focused educational programs and activities will be held at IPC APEX EXPO 2011, April 10–14, 2011, in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC’s NCEDAR CONFERENCE AIMS TO BOOST INDIA’S ELECTRONICS INDUSTRY

Industry News | 2012-11-27 15:24:14.0

IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.

Association Connecting Electronics Industries (IPC)

Karen McConnell and Linda Woody Receive IPC Presidents Award Award Presented for their Contributions to IPC and the Electronics Industry

Industry News | 2013-03-04 16:08:13.0

IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC APEX EXPO® in San Diego.

Association Connecting Electronics Industries (IPC)

SMTA Intermountain Chapter to Hold Annual Technical Symposium

Industry News | 2013-09-10 12:18:26.0

The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK's NexJet NJ-8 System Simplifies Precision Fluid Dispensing for High-throughput Applications

Industry News | 2015-09-16 11:15:59.0

Nordson ASYMTEK introduces the NexJet® NJ-8 System which improves and simplifies the dispensing process for fast-paced production environments where precision, flexibility, and long-term reliability are important. The NJ-8's ReadiSet™ 2-piece jet cartridge is quickly and easily removed, cleaned, inspected, and re-installed without tools, maximizing equipment utilization and up-time. The NexJet system is an integral part of Nordson ASYMTEK's comprehensive closed-loop dispensing systems and fully-integrated software-control of the precision jet dispensing process.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK Wins SMT China's Vision Award for its NexJet NJ-8 Jet Dispense Valve with the ReadiSet 2-piece Cartridge

Industry News | 2016-05-17 18:32:00.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), was named the winner of SMT China's 2016 Vision Award in the dispensing category for its NexJet® NJ-8 with the ReadiSet™ jet cartridge. The Vision Awards recognizes companies for their remarkable achievements in China's electronics manufacturing industry. The Award was presented at NEPCON China, held April 26-28, 2016 in Shanghai, China.

ASYMTEK Products | Nordson Electronics Solutions


column grid array searches for Companies, Equipment, Machines, Suppliers & Information

SMT spare parts - Qinyi Electronics

Component Placement 101 Training Course
Global manufacturing solutions provider

Reflow Soldering 101 Training Course
2024 Eptac IPC Certification Training Schedule

Best Reflow Oven
thru hole soldering and selective soldering needs

Training online, at your facility, or at one of our worldwide training centers"
PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals