Industry News | 2020-11-17 11:26:03.0
TopLine Corporation will exhibit in the 58th annual IEEE Nuclear and Space Radiation Effects Conference (NSREC), which will have its first Virtual Conference and Exhibition beginning November 29 and accessible through December 30. Live virtual Exhibits will be accessible December 1-8.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Scienscope video coordinate measurement machines are specifically designed for non-contact measurement and inspection of small intricate features on small or large parts. These video measurement systems are a natural step up from measuring microscope
Industry News | 2011-10-13 04:38:26.0
How are drilling and routing machines and equipment manufacturing companies performing? What strategies do they employ? What is the value of dual spindle technology and is it a global trend? To answer the third question, first you'll have to keep on reading about this fascinating technology which is becoming more and more important in the US, as well as in Asia.
Industry News | 2001-03-13 08:46:35.0
The Exhibition Hall of IMAPS 2001, The 34th International Symposium on Microelectronics, is 80% sold out, according to John Graves, General Chair of the symposium. "We are well ahead of our goal for this time, and have even outstripped our progress for last year" he stated. "We're excited, because it's going to be a terrific show and symposium, with more than 350 exhibitor booths and a cutting-edge technical conference." IMAPS 2001 takes place this coming October 9 - 11, 2001 at the Baltimore Convention Center, Baltimore, MD USA.
International Microelectronics Assembly and Packaging Society (IMAPS)
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Mon Apr 09 16:48:27 EDT 2007 | ratsalad
How wide are your pads? What paste are you using? What is your board finish? Could you please post a link to the datasheet for the component? We place a lot of MLFs, both in a Pb and Pb-free process. Our standard stencil design for MLF compon
