Industry Directory | Manufacturer / Other
Reduce electrical overstress (EOS) with our EMI filters for soldering, power, ground and servo motors. EMI filters improve equipment up-time and reliability and reduce test problems.
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-1001 Capacity: 657 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acce
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-501 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-500 Capacity: 372 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acces
New Equipment | Board Handling - Storage
Eureka XDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-101 Capacity: 93 Liters Humidity Range: ≤5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after accessing door for 30 se
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Industry News | 2009-08-04 16:58:23.0
As components get smaller and smaller, managing moisture-sensitive devices and protecting them across the entire supply chain is becoming increasingly important for electronics manufacturers. The goal is to prevent the use of moisture-damaged components at the very start of the SMD process chain.
ECD's SmartDRY™ desiccant dry cabinet, for surface mount technology (SMT) components storage, intelligently controls moisture sensitive level (MSL) to the J-STD-033 Specification while mitigating electrostatic discharge (ESD) at low relative humidity
Industry News | 2016-08-24 20:21:34.0
Seika Machinery announces that Michelle Ogihara, Senior Sales Manager, will co-chair the Moisture Sensitive Device (MSD) Council meeting during the upcoming SMTA International Conference & Exhibition. The meeting is scheduled to take place Tuesday, September 27, 2016 at 3 p.m. in room #60 in the conference area. The council welcomes all interested parties seeking solutions to their MSD issues to come with questions.
