Industry Directory | Manufacturer
Professional Audio - Hear The Power of Technology
2 line phone switch Call selector Telephone router -TCS1800 Applications: The line power call selector is suitable for people who have 2 outgoing telephone lines but want to use one single telephone set. People have a PSTN line in use, and they migh
Improve test coverage and reduce cost. The XJTAG XJLink2-CFM adds the power of XJTAG’s boundary scan solution to the Teradyne TestStation, giving test access to hard-to-probe parts of a board. Both JTAG and non JTAG devices, such as Flash, RAM, Eth
Electronics Forum | Tue Jun 26 11:45:52 EDT 2007 | Frank
I certainly wasn't endorsing the use of the PVC piping that was installed prior to my employment there. Also, I recall that all the piping was above the ceiling tiles and regular air line hose was dropped along with the power cables. So there was l
Electronics Forum | Tue Sep 21 17:03:53 EDT 1999 | The Guc
| | | | Hey all, | | | | Just got a new PC whiz bang everything but the kitchen sink, and my Quad Gui software can't run on it. I keep getting insufficient memery errors. Any Windows gurus out there who can help? I can't figure out how to allocate
Used SMT Equipment | In-Circuit Testers
Anritsu S820D 20 Ghz SiteMaster Cable Antenna Analyzer Anristu SiteMaster S820D, covering 2 MHz- 20.0 GHz, is the most accurate, reliable and convenient microwave transmission line and antenna analyzers available for installation, verification,
Used SMT Equipment | In-Circuit Testers
Anritsu S820D Base Frequency: 20 MHz Max Frequency: 20 GHz 20 Ghz SiteMaster Cable Antenna Analyzer Anristu SiteMaster S820D, covering 2 MHz- 20.0 GHz, is the most accurate, reliable and convenient microwave transmission line and antenna analyze
Industry News | 2003-05-08 07:27:27.0
Easby Electronics is offering a line of low-cost plug and socket PCB terminal blocks in a vast range of styles and sizes, which now include 3.50 and 3.81mm pitches.
Industry News | 2008-07-03 21:21:50.0
OXFORD, CT � July 2, 2008 � MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.
Parts & Supplies | Pick and Place/Feeders
GIC-F02 FUJI CP6 Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of
Parts & Supplies | Pick and Place/Feeders
GIC-R05 JUKI Feeder Calibration JIG GIC-R05 JUKI Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate prec
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
Product introduction: 1.This equipment is used to collect PCBs into magazine at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control interface; 4.The pneumatic clamps of top and botto
Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
Career Center | ZAGHOUAN, Tunisia | Engineering
-Giving support to the SMT lines, pick and place machines, AOI, printers paste, reflow ovens, paste inspection, conformal coating dispenser. -Provide solutions on failures and equipment maintenance, as well as program updates and documentation. -Sett
Career Center | 10th of ramadan, Egypt | Engineering,Maintenance,Management,Production
• Excellent Analytical, inter-personal and communication skills • Ability to work effectively in teamwork • Ability to set and achieve goals and work under pressure • Learn quickly, hard worker • Capable of study and research acti
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
| https://unisoft-cim.com/place_make-point.html
. The MAKE POINT feature may be used for a number of reasons and a common one is when making an assembly program there may not be a clear fiducial mark to use as a reference point when creating the Pick
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/orcad-pcb-editor-16-6-new-line-fillin_topic1565.html
16.6 "New Line Fillin" Posted: 23 Feb 2015 at 6:16pm tl;dr Simply uncheck the box, save it as a preference, and you're done. That button is not there for the reason you seem to think it is
