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SCI Automation specializes in plasma cleaning, etching and surface activation equipment, and provides effective cleaning and etching solutions to the Semiconductor, Electronic, Automotive, Medical and Life Science industries.
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We are Registered in 2015, Kms Electronics has immense expertise in supplying of electronic voltage Stabilizer, PCB Assembling, EMS services etc. our company is located in Chennai, Tamil Nadu and is one of the leading supplier
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JTEC-EUROPE distributes a wide range of market leading production equipment. We have excellent International service partnerships and support structure to service our customers which covers many commonly used production equipment,
ASAP NSN Parts is a recognized leader in providing all types of Aircraft and Airframe Structural Components for commercial, corporate and military aircraft. Our largest parts inventor insures you to find all types of components you need.
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Ebyte is a national high-tech enterprise specializing in the research and development of wireless modules and industrial IoT terminals. Independently developed and produced products include LoRa/WiFi Wireless Module~
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Orpro Vision supplies AOI systems and SW for the SMT market. With two headquarters in Germany and USA, we operate in the European, American, African and Israeli markets. We provide best-in-class post-reflow and post-soldering AOI.
Industry Directory | Consultant / Service Provider
Technology Contractors ( Collaborative Process Implementation, Management and consulting services, SMT/Through-Hole implementation, training, and outsourcing support.)
Key supplier of sheetmetal work and metal components ,OEM machine builder & assembler service.
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Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
