Direct Capital provides equipment financing to companies across the U.S. for new or used equipment and technology.
The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...
CFDRC's flagship software product. It consists of: CFD-GEOM (for geometry and grid generation), CFD-ACE and CFD-ACE(U) (pressure-based, finite-volume flow solvers for multiblock structured and unstructured hybrid grids) and CFD-VIEW (for post process
As above with a CTE of 11ppm/C. More robust material that is used for structural applications, housings etc.
Technical Library | 2016-09-15 17:10:40.0
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliability data for printed wiring board (PWB) materials for use in applications that require 20+ years (100,000+ hours) of operational life under different thermal conditions. Underwriters Laboratory (UL) testing only addresses unclad laminate (resin and glass) and not a fabricated PWB that undergoes many processing steps, includes copper and plated through holes, and has a complex mechanical structure. UL testing is based on a 5000 hour expected operation life of the electronic product. Therefore, there is a need to determine the dielectric breakdown / degradation of the composite printed circuit board material and mechanical structure over time and temperature for mission critical applications.
Technical Library | 2021-01-21 02:04:27.0
Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour.
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Used SMT Equipment | Pick and Place/Feeders
Model: SM421 Mounting speed: 1608 Chip 21,000CPH 1005 Chip 20,000 CPH SOP16:15,000 CPH/feeder QFP100:5,000 CPH/tray Component recognition range:0402 ~ □7mm IC (CSP 0.65) 0603 ~ □12mm IC (CSP 0.75) ~ □17mm IC (0.3P) ~ □42
Career Center | , Mississippi USA | Engineering,Production
About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities
Industry Directory | Manufacturer
Our company is bent on design, manufacture, sale & service of solar laminator.
