The next generation of in-house prototyping Laser-based PCB production can achieve much greater circuit detail, and lasers structure circuits significantly faster. This technology provides true on-demand production solution for both prototyping and
New Equipment | Test Equipment
The SME03 is a favorably priced signal generator for applications in the 5 kHz to 3 GHz frequency range. The SME supplies the complex signals required for the development and testing of digital mobile radio receivers. It is capable of generating al
Industry Directory | Recruiter / Employment Company
As a well known and respected member of the search industry, Clear Concepts has been a partner in many critical search situations. From confidential replacement of incumbents to finding the key people for high growth startups and turnaround efforts,
Industry Directory | Consultant / Service Provider / Manufacturer
Lepla srl electronic contract manufacturer, specialized in the SMT & THT Electronic Cards Assembling, Wiring Assembling Harness, In-Circuit, Parametric and Functional Testing.
Industry News | 2016-10-06 16:10:21.0
Microtek welcomed Councilman Mark Kersey of San Diego’s Fifth District prior to participating in the companies’ first Manufacturing Day event on October 7th.
Industry News | 2016-11-21 17:14:10.0
Aegis Software today announced a structural expansion to its operations in the Americas to support the rapid increase in its large-scale MES system installations as well as scaling of the global organization. With the appointment of Brian Backenstose as the Managing Director of Aegis Americas, Aegis now has parallel management and organizational structures in each of its three divisions of the Americas, Europe and Asia. Beyond improvements to corporate scaling to meet demand, this new structure enables efficient cross-divisional engineering and customer services coordination.
Technical Library | 2020-07-22 19:39:05.0
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2.
Technical Library | 2021-11-22 20:44:44.0
Many automated optical inspection (AOI) companies use supervised object detection networks to inspect items, a technique which expends tremendous time and energy to mark defectives. Therefore, we propose an AOI system which uses an unsupervised learning network as the base algorithm to simultaneously generate anomaly alerts and reduce labeling costs. This AOI system works by deploying the GANomaly neural network and the supervised network to the manufacturing system. To improve the ability to distinguish anomaly items from normal items in industry and enhance the overall performance of the manufacturing process, the system uses the structural similarity index (SSIM) as part of the loss function as well as the scoring parameters. Thus, the proposed system will achieve the requirements of smart factories in the future (Industry 4.0).
Industry News | 2008-08-01 00:56:43.0
Agilent Technologies Inc. (NYSE: A) today announced that its N9201A Array Structure Parametric Test Solution won the Semiconductor International 2008 Editor's Choice Best Product Award for excellence in semiconductor manufacturing. The Editor's Choice Best Product Award recognizes proven products that have been acknowledged by users for providing superior performance and capabilities in semiconductor manufacturing.
