Industry News | 2001-02-13 08:23:07.0
IPC has announced the release of The 2000/2001 National Technology Roadmap for Electronic Interconnections. This roadmap provides a vision and direction for product development, process development and services required to satisfy the current and future needs of companies building electronic equipment.
Industry News | 2017-03-31 17:21:11.0
IPC – Association Connecting Electronics Industries®, is proud to announce the growing involvement of the Connected Factory Exchange (CFX). The 2-17 Connected Factory Initiative Subcommittee is comprised of representatives of the electronic industry’s leading manufacturers, machine, device, sensor and software companies.
Industry News | 2019-04-30 18:05:43.0
Nordson ASYMTEK will exhibit its new conformal coating line and dispensing solutions at SMTconnect, Nuremberg, Germany, with SmartTec GmbH in Stand 4-101 and in the Fraunhofer IZM Future Packaging Line Stand 5-434. In addition, Gerd Schulze, key account manager, Nordson ASYMTEK, will present "Protecting Electronics -- Adhesive and potting options and practical examples" at SMTconnect Technology Days. SMTconnect is being held May 7-9, 2019.
Industry News | 2011-01-20 13:54:40.0
IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.
Industry News | 2019-02-19 19:38:20.0
PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry.
Industry News | 2022-03-03 16:21:56.0
During his State of the Union address tonight, U.S. President Joe Biden is expected to urge Congress to pass much-needed funding for semiconductor manufacturing and other advanced technologies as part of a new competitiveness measure. Both the House- and Senate-passed bills include $52 billion in funding as well as additional measures to boost American R&D, which will help reestablish the United States as a global leader in building the technologies of the future. IPC applauds President Biden's continued focus on the semiconductor shortage and his ongoing efforts with Congress to finalize the "USICA/America COMPETES" legislation.
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
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