MPM UP 2000 HIE for sale,if you interested welcome to contact us soon. BOARD HANDLING Minimum/ 2" x 2" (50.0 mm x 50.0 mm) to Maximum size 20" x 16" (508 mm x 406 mm) (16" or greater board lengths require dedicated workholder) Thickness range
Used SMT Equipment | Pick and Place/Feeders
Siemens Siplace S27 HM Placement machine (2006) Brand: Siemens Model: Siplace S27 HM Year: 2006 Serial: 507-12031719 Type: Placement machine Machine Specifications: Touch Screen: Yes Operational: Yes Range of components: 0.6 x 0.3 mm2 (
Industry News | 2016-03-16 20:57:21.0
In regard to the placement processes used for electronic circuit boards, there are ever growing calls for high-mix, as well as variable-mix and variable-volume production in order to keep up with changes in the marketplace. In order to meet these demands, Fuji developed the flexible and expandable AIMEX IIIc, which was announced in October 2015. On this occasion we would like to announce the release of the AIMEX III, a machine built with the same concepts as the AIMEX IIIc, as well as the ability to produce large panels.
Industry News | 2015-10-26 01:14:57.0
Fuji Machine Manufacturing Corporation (headquarters: Chiryu, Aichi; president & CEO: Mr. Nobuyuki Soga; hereafter called as "Fuji") has developed and added a new product, an electrical component placement machine (mounter) "AIMEX IIIc", in the product line. This machine is going to be displayed at the Fuji Mount Technology Show 2015 that will be held at Fuji headquarters on November 26th and 27th.
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Electronics Forum | Wed Feb 24 04:22:38 EST 2016 | dzadza
Hi, I'm trying to use the PCB SYNERGY software, when I press the process button the following message appears. PADS ASCII 2005 file in development!... NoSMTComponents = 0 NoComponents = 0 NoSMTFeeders = 0 NoFeeders = 0 This file is suitable for SM
Electronics Forum | Wed Feb 09 09:59:25 EST 2005 | aj
Randy, We have a Dek 265GSX and 265 MK1. We print 20thou pitch components, 0.5mm. Just make sure you have good board support and USC. aj
Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler
The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs
Electronics Forum | Wed Sep 06 06:04:16 EDT 2000 | Dreamsniper
Hi Guys, I'd like to collect info regarding YAMAHA YV88 Mark2 and YV100 series. Are they of any good compare to Universal GSM1 or Panasert MPAV2 ? My new company's products have hips of fine pitch components (0.5mm) and we are planning to get new eq
Electronics Forum | Mon Dec 20 07:58:02 EST 1999 | pascal MATHIEU
hello guys ; we are using a fine pitch component(0.65mm) on a thick copper PCB (Cu = 90�m) ; in this case we notice that we are in the process'limits , because the different supplier of the PCB are not able to ensure a good stability of it's process
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