Industry News | 2009-02-21 17:56:00.0
BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
New Equipment | Test Equipment
The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling cap
Photonic Products Ltd, the UK optoelectronics device manufacturer and laser diode specialist, has launched a 25mW version of their hugely popular 405nm (blue-violet) Photon laser diode modules with TTL modulation. The 25mW output power offered by th
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Events Calendar | Wed Jun 19 00:00:00 EDT 2019 - Sat Jun 22 00:00:00 EDT 2019 | Bangkok, Thailand
NEPCON Thailand - Assembly, Measurement and Testing Technologies for Electronics Manufacturing Expo
Industry News | 2009-04-01 08:19:31.0
Cambridge Operation
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2017-01-25 10:09:23.0
Register now for the 38th Annual EOS/ESD Symposium to be held September 11-16, 2016, at the Hyatt Regency Orange County, Garden Grove (Anaheim), CA, USA. Benchmark your company’s operation against the practices of other companies. Solve business challenges in controlling ESD by networking with other ESD professionals and industry experts to learn best practices and technology advancements for ESD Control.
