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UV Laser Depaneling System

UV Laser Depaneling System

Videos

UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration

Winsmart Electronic Co.,Ltd

Fids-on-the-Fly High-Speed Fiducial Capture

Fids-on-the-Fly High-Speed Fiducial Capture

New Equipment | Dispensing

Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a

ASYMTEK Products | Nordson Electronics Solutions

Fuji Module Width 320mm Surface Mount Placement Machine Fuji Scalable Placement Platform NXT Ⅱ

Fuji Module Width 320mm Surface Mount Placement Machine Fuji Scalable Placement Platform NXT Ⅱ

Used SMT Equipment | Pick and Place/Feeders

Brand: FUJI Name: FUJI Scalble Placement Platform NXT Ii Module Width: 320mm Machine Dimensions: L:1295mm(M3 II×4, M6 II×2) Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Trays: Applicable Tr

KingFei SMT Tech

Count On Tools Introduces Customized Shipping Options

Industry News | 2011-09-28 19:07:01.0

Count On Tools introduces new shipping options and an online shipping calculator, allowing customers to customize the shipping process for online orders.

Count On Tools, Inc.

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

DEK E SMT Stencil Printer

DEK E SMT Stencil Printer

New Equipment | Pick & Place

2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm   DEK E SMT Stencil Printer DEK E SMT Stenc

Qersa Technology Co.,ltd

Stencil thickness calculations

Industry News | 2018-10-18 10:15:05.0

Stencil thickness calculations

Flason Electronic Co.,limited

Stencil thickness calculations

Industry News | 2018-10-18 10:15:06.0

Stencil thickness calculations

Flason Electronic Co.,limited

Fuji XPF-L

Fuji XPF-L

Used SMT Equipment | Pick and Place/Feeders

XPF-S/L Multifunctional Universal Machine • Mounting speed: rotating automatic head replacement: 0.144sec/ 25000cph                      

Qinyi Electronics Co.,Ltd


component calculation searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications